Pressure Click Board
LPS331AP is a digital output pressure sensor offered in an ultra-compact holed cap land grid array package. Designed to measure pressure or temperature, this chip features a monolithic sensing element that detects pressure while an IC interface that takes information from the sensing element and provide a digital signal to the external world.
Manufacturing Process: VENSENS
Intended to detect pressure, LPS331AP pressure sensor is manufactured using a specific proprietary process called VENSENS. It allows to build a mono-silicon membrane above an air cavity with controlled gap and defined pressure. Compared to traditional silicon micromachined membranes, this membrane is very small. Intrinsic mechanical stoppers prevent membrane breakage.
SMD JumpersDepending on the position of four jumpers—J1, J2, J3 and J4, pressure click uses I2C or SPI interface to communicate with the main board. In the default position, the jumpers are soldered in I2C line. The user is capable of selecting the alternate address with J5 in the case of I2C interface (default position is logic 1).
- Pressure Click Module (1)
- 1x8 male headers (2)
- Printed User Manual and Board Schematic (1)
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